Thermal–Mechanical and Microstructural Simulation of Rotary Friction Welding Processes by Using Finite Element Method

Author:

Mani Hossein1,Taherizadeh Aboozar1ORCID,Sadeghian Behzad1,Sadeghi Behzad2ORCID,Cavaliere Pasquale2ORCID

Affiliation:

1. Department of Materials Engineering, Isfahan University of Technology, Isfahan 8415683111, Iran

2. Department of Innovation Engineering, University of Salento, Via per Arnesano, 73100 Lecce, Italy

Abstract

Rotary friction welding is one of the most crucial techniques for joining different parts in advanced industries. Experimentally measuring the history of thermomechanical and microstructural parameters of this process can be a significant challenge and incurs high costs. To address these challenges, the finite element method was used to simulate thermomechanical and microstructural aspects of the welding of identical superalloy Inconel 718 tubes. Numerical simulation results were used to compute essential mechanical and metallurgical parameters such as temperature, strain, strain rate, volume fraction of dynamic recrystallization, and grain size distribution. These parameters were subsequently verified using experimental test results. The Johnson–Avrami model was utilized in the microstructural simulation to convert thermomechanical parameters into metallurgical factors, employing a FORTRAN subroutine. The calculated thickness of the recrystallization zone in the wall was 480 and 850 μm at the tube wall’s center and edge, respectively. These values were reported from experimental measurements as 500 and 800 μm, respectively. The predicted grain size changes from the center to the edge of the wall thickness, near the weld interface, ranged from 2.07 to 2.15 μm, comparable to the experimental measurements ranging from 1.9 to 2.2 μm. Various curves are also presented to explore the correlation between thermomechanical and microstructural parameters, with the experimental results revealing predictable microstructure evolutions correlated with thermomechanical changes.

Publisher

MDPI AG

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