Finite Element Approach for the Simulation of Modern MRAM Devices

Author:

Fiorentini Simone12ORCID,Jørstad Nils Petter12ORCID,Ender Johannes12ORCID,de Orio Roberto Lacerda2ORCID,Selberherr Siegfried2ORCID,Bendra Mario12ORCID,Goes Wolfgang3,Sverdlov Viktor12ORCID

Affiliation:

1. Christian Doppler Laboratory for Nonvolatile Magnetoresistive Memory and Logic at the Institute for Microelectronics, TU Wien, Gußhausstraße 27-29/E360, 1040 Vienna, Austria

2. Institute for Microelectronics, TU Wien, Gußhausstraße 27-29/E360, 1040 Vienna, Austria

3. Silvaco Europe Ltd., Cambridge PE27 5JL, UK

Abstract

Because of their nonvolatile nature and simple structure, the interest in MRAM devices has been steadily growing in recent years. Reliable simulation tools, capable of handling complex geometries composed of multiple materials, provide valuable help in improving the design of MRAM cells. In this work, we describe a solver based on the finite element implementation of the Landau–Lifshitz–Gilbert equation coupled to the spin and charge drift-diffusion formalism. The torque acting in all layers from different contributions is computed from a unified expression. In consequence of the versatility of the finite element implementation, the solver is applied to switching simulations of recently proposed structures based on spin-transfer torque, with a double reference layer or an elongated and composite free layer, and of a structure combining spin-transfer and spin-orbit torques.

Funder

Christian Doppler Research Association

TU Wien Library through its Open Access Funding Program

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Micromagnetic modeling of SOT-MRAM dynamics;Physica B: Condensed Matter;2024-03

2. Numerical study of two-terminal SOT-MRAM;Physica B: Condensed Matter;2024-01

3. A multi-level cell for ultra-scaled STT-MRAM realized by back-hopping;Solid-State Electronics;2023-10

4. Spin Drift-Diffusion Boundary Conditions for FEM Modeling of Multilayer SOT Devices;2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD);2023-09-27

5. A Comprehensive Study of Temperature and Its Effects in SOT-MRAM Devices;Micromachines;2023-08-11

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