Finite Element Approach for the Simulation of Modern MRAM Devices
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Published:2023-04-22
Issue:5
Volume:14
Page:898
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ISSN:2072-666X
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Container-title:Micromachines
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language:en
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Short-container-title:Micromachines
Author:
Fiorentini Simone12ORCID, Jørstad Nils Petter12ORCID, Ender Johannes12ORCID, de Orio Roberto Lacerda2ORCID, Selberherr Siegfried2ORCID, Bendra Mario12ORCID, Goes Wolfgang3, Sverdlov Viktor12ORCID
Affiliation:
1. Christian Doppler Laboratory for Nonvolatile Magnetoresistive Memory and Logic at the Institute for Microelectronics, TU Wien, Gußhausstraße 27-29/E360, 1040 Vienna, Austria 2. Institute for Microelectronics, TU Wien, Gußhausstraße 27-29/E360, 1040 Vienna, Austria 3. Silvaco Europe Ltd., Cambridge PE27 5JL, UK
Abstract
Because of their nonvolatile nature and simple structure, the interest in MRAM devices has been steadily growing in recent years. Reliable simulation tools, capable of handling complex geometries composed of multiple materials, provide valuable help in improving the design of MRAM cells. In this work, we describe a solver based on the finite element implementation of the Landau–Lifshitz–Gilbert equation coupled to the spin and charge drift-diffusion formalism. The torque acting in all layers from different contributions is computed from a unified expression. In consequence of the versatility of the finite element implementation, the solver is applied to switching simulations of recently proposed structures based on spin-transfer torque, with a double reference layer or an elongated and composite free layer, and of a structure combining spin-transfer and spin-orbit torques.
Funder
Christian Doppler Research Association TU Wien Library through its Open Access Funding Program
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Reference65 articles.
1. Standby-Power-Free Integrated Circuits Using MTJ-based VLSI Computing;Hanyu;Proc. IEEE,2016 2. Gallagher, W.J., Chien, E., Chiang, T., Huang, J., Shih, M., Wang, C.Y., Weng, C., Chen, S., Bair, C., and Lee, G. (2019, January 7–11). 22nm STT-MRAM for Reflow and Automotive Uses with High Yield, Reliability, and Magnetic Immunity and with Performance and Shielding Options. Proceedings of the 2019 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA. 3. Han, S.H., Lee, J.M., Shin, H.M., Lee, J.H., Suh, K.S., Nam, K.T., Kwon, B.S., Cho, M.K., Lee, J., and Jeong, J.H. (2020, January 12–18). 28-nm 0.08 mm2/Mb Embedded MRAM for Frame Buffer Memory. Proceedings of the IEDM Conference, San Francisco, CA, USA. 4. Shih, Y.C., Lee, C.F., Chang, Y.A., Lee, P.H., Lin, H.J., Chen, Y.L., Lo, C.P., Lin, K.F., Chiang, T.W., and Lee, Y.J. (2020, January 12–18). A Reflow-Capable, Embedded 8Mb STT-MRAM Macro with 9ns Read Access Time in 16nm FinFET Logic CMOS Process. Proceedings of the IEDM Conference, San Francisco, CA, USA. 5. Naik, V.B., Yamane, K., Lee, T., Kwon, J., Chao, R., Lim, J., Chung, N., Behin-Aein, B., Hau, L., and Zeng, D. (2020, January 12–18). JEDEC-Qualified Highly Reliable 22nm FD-SOI Embedded MRAM For Low-Power Industrial-Grade, and Extended Performance Towards Automotive-Grade-1 Applications. Proceedings of the IEDM Conference, San Francisco, CA, USA.
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