Joining of Carbon Fiber Reinforced Plastic to Aluminum Alloy by Reactive Multilayer Films and Low Power Semiconductor Laser Heating

Author:

Ma Ying,Bridges Denzel,Yu Yongchao,Han Jitai,Li Hong,Hu AnmingORCID

Abstract

This study investigated the characteristics and strength of the dissimilar joints between carbon fiber reinforced plastic (CFRP) epoxy composites and aluminum alloys using two different heating methods, Ni/Al reactive multilayer films (RMF) and a low power continuous wave diode laser. To enhance the adhesion, the top resin layer of the CFRP and the surface of the aluminum alloy were patterned by femtosecond laser. Polycarbonate (PC) was used as a filler material during the joining processes. ANSYS simulation was applied to elucidate the thermal kinetics of the self-propagation reaction and the thermal profile, and evaluate the possibility of joining CFRP to aluminum using Ni/Al RMFs. The SEM image of the cross-section shows that melted PC flowed into the CFRP–aluminum alloy interface, suggesting strong mechanical bonding. A tensile strength of 9.5 MPa was reached using Ni/Al multilayers as heat sources, which provides a new way for joining CFRPs and aluminum alloys in space or under water.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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