Effects of Ultrashort Pulsed Direct Laser Writing on Ni/Al Reactive Multilayer Foils

Author:

Martins Maria Amélia1,Müller Daniel Wyn1ORCID,Schmauch Jörg2,Glaser Marcus3ORCID,Bergmann Jean Pierre3ORCID,Mücklich Frank14,Pauly Christoph1ORCID

Affiliation:

1. Department of Materials Science, Institute for Functional Materials, Saarland University, Campus D3.3, 66123 Saarbrücken, Germany

2. Institute of Experimental Physics, Saarland University, Campus D2.2, 66123 Saarbrücken, Germany

3. Production Technology Group, Department of Mechanical Engineering, Institute of Micro and Nanotechnology MacroNano®, Technische Universität Ilmenau, Gustav-Kirchhoff-Platz 2, 98693 Ilmenau, Germany

4. Materials Engineering Center Saarland (MECS), Campus D3.3, 66123 Saarbrücken, Germany

Abstract

Reactive multilayer foils (RMFs) for joining processes have attracted a great deal of attention over the last few years. They are capable of exothermic self-propagating reactions and can serve as localized heat sources for joining applications when ignited by suitable means. Using short and ultrashort pulsed lasers with carefully selected parameters, cutting and shaping of RMFs makes it possible to tailor heat release characteristics without triggering the reaction. The present study is an investigation of microstructural changes induced by femtosecond laser machining of a commercially available Ni/Al-based RMF. The effects of the specific laser parameters pulse duration and repetition rate on the heat-affected zone (HAZ) are investigated by scanning and transmission electron microscopy. Debris consisting of oxide deposits can be found at a distance of several tens of microns from the cut edge. A negligible HAZ extending to less than 100 nm was observed for all parameters tested and no signs of ignition of a self-propagating reaction were observed. These results underline the suitability of femtosecond lasers for metal machining with minimal heat input.

Funder

Deutsche Forschungsgemeinschaft

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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