The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders
Author:
Publisher
MDPI AG
Subject
General Materials Science,Metals and Alloys
Link
http://www.mdpi.com/2075-4701/7/12/540/pdf
Reference33 articles.
1. Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150°C
2. Status and trend of automotive power packaging
3. Reliability of high temperature solder alternatives
4. Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications
5. Plate-like cell growth during directional solidification of a Zn–20wt%Sn high-temperature lead-free solder alloy
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