Abstract
This paper presents an extensive review of the main highlights in the Temperature-to-Digital Converters (TDCs) field, which has gained importance and research interest throughout the last two decades. The key techniques and approaches that have led to the evolution of this kind of systems are presented and compared; their peculiarities are identified in order to highlight the pros and cons of the different design methods, and the main trade-offs are extracted from this analysis. Finally, the trends that have emerged from the performance evaluation of the large amount of published works in this field are identified with the purpose of providing a directional view of the past, present and future features of these devices.
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Reference87 articles.
1. Rupp, K. (2022, October 05). 42 Years of Microprocessor Trend Data. Available online: www.karlrupp.net/2018/02/42-years-of-microprocessor-trend-data.
2. An overview and classification of thermal-aware scheduling techniques for multi-core processing systems;Sustain. Comput. Inform. Syst.,2012
3. Miniaturized BJT-Based Thermal Sensor for Microprocessors in 32- and 22-nm Technologies;IEEE J. Solid-State Circuits,2013
4. Compact BJT-Based Thermal Sensor for Processor Applications in a 14 nm tri-Gate CMOS Process;IEEE J. Solid-State Circuits,2015
5. A Miniaturized 0.003 mm2 PNP-Based Thermal Sensor for Dense CPU Thermal Monitoring;IEEE Trans. Circuits Syst. I: Regul. Pap.,2020
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献