Impulse Pressure-Assisted Diffusion Bonding (IPADB): Review and Outlook

Abstract

Diffusion bonding is a solid-state welding technique used to join similar and dissimilar materials. Relatively long processing times, usually in the order of several hours as well as fine polished surfaces make it challenging to integrate diffusion bonding in other production processes and mitigate widespread use of the technology. Several studies indicate that varying pressure during diffusion bonding in contrast to the traditionally applied constant load may reduce overall processing- and bonding times. Such processes are referred to as impulse pressure-assisted diffusion bonding (IPADB) and they are, for the first time, reviewed in this work using the PRISMA (Preferred Reporting Items for Systematic Reviews and Meta-Analysis) methodology. Results of the review indicate that varying pressure can indeed reduce bonding times in diffusion bonding and reduce the requirements for pre-bond surface preparation. Additional research is required and should go beyond small and simple sample geometries to concentrate on making IPADB accessible to industrial applications.