Affiliation:
1. The Fifth Electronics Research Institute of the Ministry of Industry and Information Technology, Guangzhou 511370, China
2. National and Local Joint Engineering Research Center of Reliability Analysis and Testing Technology of Electronic Information Products, Guangzhou 511370, China
Abstract
In this paper, high-temperature storage of hydrogen-treated AlGaN/GaN HEMTs is conducted for the first time to study the effect of high temperature on the electrical characteristics of the devices after hydrogen treatment, and it is found that high-temperature storage can effectively reduce the impact of hydrogen on the devices. After hydrogen treatment, the output current and the maximum transconductance of the device increase, and the threshold voltage drifts negatively. However, after high-temperature treatment at 200 °C for 24 h, the output current, threshold voltage, and the maximum transconductance of the device all approach their initial values before hydrogen treatment. By using low-frequency noise analysis technology, the trap density of the hydrogen-treated AlGaN/GaN HEMT is determined to be 8.9 × 1023 cm−3·eV−1, while it changes to 4.46 × 1022 cm−3·eV−1 after high-temperature storage. We believe that the change in the electrical characteristics of the device in hydrogen is due to the passivation of hydrogen on the inherent trap of the device, and the variation in the electrical properties of the device in the process of high-temperature storage involves the influence of two effects, namely the dehydrogenation effect and the improvement of the metal–semiconductor interface caused by high temperatures.
Funder
Guangzhou Science and Technology Project Fund
National Natural Science Foundation of China
Reference38 articles.
1. Reducing the reverse leakage current of AlGaN/GaN heterostructures via low-fluence neutron irradiation;Wang;J. Mater. Chem. C,2021
2. Islam, N., Mohamed, M.F.P., Khan, M.F.A.J., Falina, S., Kawarada, H., and Syamsul, M. (2022). Applications and challenges of GaN HEMT technology for modern power devices: A review. Crystals, 12.
3. Investigation of surface related leakage current in AlGaN/GaN high electron mobility transistors;Kaushik;Thin Solid Films,2016
4. Camp, W.O., Lasater, R., Genova, V., and Hume, R. (1989, January 22–25). Hydrogen effects on reliability of GaAs MMICs. Proceedings of the 11th Annual Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, San Diego, CA, USA.
5. HEMT degradation in hydrogen gas;Chao;IEEE Electron Device Lett.,1994