Research on Subsurface Damage Measurement of Fused Silica in Ultra-Precision Grinding Based on Laser Damage Performance

Author:

Zhong Yaoyu1,Xu Mingjin2,Kuang Wenjun1,Wan Fubin1,Lin Zhifan3,Fan Yansong1,Hu Qingqing1ORCID,Xu Fufang1

Affiliation:

1. National Innovation Institute of Defense Technology, Academy of Military Sciences, Beijing 100091, China

2. College of Naval Architecture and Ocean Engineering, Naval University of Engineering, Wuhan 430033, China

3. China Astronauts Research and Training Center, Beijing 100094, China

Abstract

In order to achieve accurate prediction of subsurface damage (SSD) in ultra-precision grinding of high-performance ultra-violet laser-irradiated fused silica optics, the paper combines damage precursor multimodal measurement technology with magnetorheological finishing spot method detection. Various methods such as photothermal weak absorption and fluorescence confocal imaging are used for measuring the surface roughness and subsurface damage depth of a series of fused silica samples prepared under different ultra-precision grinding parameters. The correlation between surface roughness and subsurface damage depth in ultra-precision grinding based on laser damage performance is established using curve fitting. The results indicate that there is a metamorphic layer below the subsurface crack layer, which can cause additional photothermal absorption. Subsurface damage is constituted of the subsurface crack layer and metamorphic layer. Under ultra-precision grinding conditions, the maximum depth of subsurface damage is generally 2.00–4.22 times the depth of the subsurface damage cluster. The roughness Ra and the subsurface damage cluster depth correspond to SSD(cluster) = 195 × Ra − 0.13. The maximum depth of subsurface damage can be predicted by measuring the Ra value, by which accurate prediction of defect depth in ultra-precision grinding and guiding the high-performance manufacturing of ultra-violet laser-irradiated fused silica optics can be achieved.

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

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