Pattern Formation by Spinodal Decomposition in Ternary Lead-Free Sn-Ag-Cu Solder Alloy

Abstract

In comparison to Pb-based solders which have a toxic effect, the tin-silver-copper (SAC) family of alloys have relatively strong reliability and are widely used in the electronics industry. Phase separation and coarsening phenomenon on the surface of 96.5 wt. % Sn-3.0 wt. % Ag-0.5 wt. % Cu (SAC305) solder products exhibit special microstructural features and offer opportunities for the microstructure control of microelectronic interconnects. However, the formation mechanism of such morphological patterns is still unknown. Here, we applied a combination of experimental and phase field methods to study how such patterns form. It was observed that the pattern was Sn-rich and exhibited the characteristic morphology of spinodal decomposition. Contrary to earlier findings that only binary systems like Sn-Pb and Sn-Bi experienced such phenomena, spinodal decomposition was firstly observed in ternary solder system Sn-Ag-Cu. Morphology of Sn-rich patterns depended on whether the spinodal decomposition reacted completely. SAC305 solder alloy was easily decomposed by Sn component after being heated to roughly 260 °C. The above conclusions could offer theoretical support for quantitatively controlling the microstructure of solder alloys and would enhance the quality of related products.