Online Deformation Measurement of Laser Repair Substrate Based on Orthogonal Sampling Moiré

Author:

Shi Wenxiong,Zhang Chenghao,Xie Huimin

Abstract

As an important branch of metal additive manufacturing, laser repair has broad application potential in the aerospace, automobile and ship building industries. In the process of laser repair, metal powder is introduced into the laser action area and heated to a molten state to form a molten pool, which moves on the component surface according to the preset scanning path. Additionally, the temperature of the repaired component changes dynamically with the movement of the molten pool, leading to the time-evolution of stress and deformation. Therefore, online deformation measurement for the repair process is essential for understanding the evolution mechanism of stress and deformation in laser repair. However, extreme environments such as ultra-high temperature, strong laser radiation and metal powder splashing exist during the laser repair, which bring great challenges for dynamic optical measurement. In this paper, an online deformation measurement system based on orthogonal sampling moiré for laser repair environment is developed, which is applied to measure the deformation field of the metal substrate during laser repair. In the measurement, laser repair is performed on a cantilever beam substrate and orthogonal grating is prepared on the side surface of the cantilever beam. The real-time grating images are recorded by an optical imaging system, in which a group of filter components are used to obtain optical images with high signal-to-noise ratio. Finally, the deformation field of the substrate during laser repair is calculated with the orthogonal sampling moiré method. The results show that the scanning path in the repair process has a significant influence on the distribution of residual deformation, which offers reference for optimizing parameters of laser repair.

Funder

National Natural Science Foundation of China

National Key Research and Development Program of China

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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