The Fabrication and Characterization of Silicon Surface Grooving Using the CV Etching Technique for Front Deep Metallic Contact Solar Cells
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Published:2023-11-06
Issue:21
Volume:15
Page:15638
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ISSN:2071-1050
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Container-title:Sustainability
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language:en
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Short-container-title:Sustainability
Author:
Rabha Mohamed Ben1ORCID, Choubani Karim2ORCID, Bouktif Belgacem1, Almeshaal Mohammed A.2, Trabelsi Khaled3, Hajjaji Anouar3, Ennetta Ridha4ORCID, Bouabidi Abdallah4, Papathi Murugesan Palaniappan2
Affiliation:
1. Laboratoire de Nanomatériaux et Systèmes pour Énergies Renouvelables, Centre de Recherches et des Technologies de l’Énergie, Technopôle de Borj-Cédria, BP 95 Hammam-Lif, Tunis 2050, Tunisia 2. College of Engineering, Imam Mohammad Ibn Saud Islamic University, Riyadh 11432, Saudi Arabia 3. Laboratoire de Photovoltaïque, Centre de Recherches et des Technologies de l’Energie, Technopole de Borj Cédria, BP 95, Hammam-Lif 2050, Tunisia 4. Research Unit: Mechanical Modeling, Energy & Materials (M2EM), UR17ES47, National School of Engineers of Gabes (ENIG), Avenue of Omar Ib-Elkhattab, Zrig, Gabes 6023, Tunisia
Abstract
This study experimentally investigated the use of the chemical vapor etching method for silicon surface grooving for regular front deep metallic contact solar cell applications. The thickness of silicon wafers is a crucial parameter in the production of solar cells with front and back buried contacts, because silicon surface grooves result in a larger contact area, which in turn improves carrier collection and increases the collection probability for minority carriers. A simple, low-cost HNO3/HF chemical vapor etching technique was used to create grooves on silicon wafers with the help of a highly effective anti-acid mask. The thick porous layer of powder that was produced was easily dissolved in water, leaving patterned grooved areas on the silicon substrate. A linear dependence was observed between the etched thickness and time, suggesting that the etching process followed a constant etch rate, something that is crucial for ensuring precise and reproducible etching results for the semiconductor and microfabrication industries. Moreover, by creating shorter pathways for charge carriers to travel to their respective contacts, front deep contacts minimize the overall distance they need to traverse and therefore reduce the chance of carrier recombination within the silicon material. As a result, the internal quantum efficiency of solar cells with front deep metallic contacts improved by 35% compared to mc-Si solar cells having planar contacts. The use of front deep contacts therefore represents a forward-looking strategy for improving the performance of silicon solar cells. Indeed, this innovative electrode configuration improves charge carrier collection, mitigates recombination losses, and ultimately leads to more efficient and effective solar energy conversion, which contributes to sustainable energy development in the areas of clean energy resources. Further work needs to be undertaken to develop energy sustainably and consider other clean energy resources.
Subject
Management, Monitoring, Policy and Law,Renewable Energy, Sustainability and the Environment,Geography, Planning and Development,Building and Construction
Reference36 articles.
1. Hollow silicon microneedle fabrication using advanced plasma etch technologies for applications in transdermal drug delivery;Bolton;Lab A Chip,2020 2. Han, M., Smith, D., Ng, S.H., Vilagosh, Z., Anand, V., Katkus, T., Reklaitis, I., Mu, H., Ryu, M., and Morikawa, J. (2022). THz Filters Made by Laser Ablation of Stainless Steel and Kapton Film. Micromachines, 13. 3. Feng, W., Li, P., Zhang, H., Sun, K., Li, W., Wang, J., Yang, H., and Li, X. (2023). Silicon Micromachined TSVs for Backside Interconnection of Ultra-Small Pressure Sensors. Micromachines, 14. 4. Deep Dry Etching of Silicon with Scallop Size Uniformly Larger than 300 nm;Lin;Silicon,2018 5. Femtosecond laser microstructuring of materials;Perrie;Appl. Surf. Sci.,1998
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