Impact of Copper Stabilizer Thickness on SFCL Performance with PV-Based DC Systems Using a Multilayer Thermoelectric Model

Author:

Alafnan Hamoud1ORCID,Pei Xiaoze2ORCID,Mansour Diaa-Eldin A.34ORCID,Khedr Moanis2,Song Wenjuan5ORCID,Alsaleh Ibrahim1ORCID,Albaker Abdullah1ORCID,Alturki Mansoor1ORCID,Zeng Xianwu6

Affiliation:

1. Department of Electrical Engineering, College of Engineering, University of Ha’il, Ha’il 55476, Saudi Arabia

2. Department of Electronic and Electrical Engineering, University of Bath, Bath BA2 7AY, UK

3. Department of Electrical Power Engineering, Faculty of Engineering, Egypt-Japan University of Science and Technology (E-JUST), Alexandria 21934, Egypt

4. Department of Electrical Power and Machines Engineering, Faculty of Engineering, Tanta University, Tanta 31511, Egypt

5. James Watt School of Engineering, University of Glasgow, Glasgow G12 8QQ, UK

6. Department of Mechanical Engineering, University of Bath, Bath BA2 7AY, UK

Abstract

Utilizing renewable energy sources (RESs) to their full potential provides an opportunity for lowering carbon emissions and reaching a state of carbon neutrality. DC transmission lines have considerable potential for the integration of RESs. However, faults in DC transmission lines are challenging due to the lack of zero-crossing, large fault current magnitudes and a short rise time. This research proposes using a superconducting fault current limiter (SFCL) for effective current limitation in PV-based DC systems. To properly design an SFCL, the present work investigates the effect of copper stabilizer thickness on SFCL performance by using an accurate multilayer thermoelectric model. In the MATLAB/Simulink platform, the SFCL has been modeled and tested using different copper stabilizer thicknesses to demonstrate the effectiveness of the SFCL model in limiting the fault current and the impact of the copper stabilizer thickness on the SFCL’s performance. In total, four different thicknesses of the copper stabilizer were considered, ranging from 10 μm to 80 μm. The current limitation and voltage profile for each thickness were evaluated and compared with that without an SFCL. The developed resistance and temperature profiles were obtained for various thicknesses to clarify the mechanisms behind the stabilizer-thickness impact. An SFCL with an 80 µm copper stabilizer can reduce the fault current to 5.48 kA, representing 71.16% of the prospective current. In contrast, the fault current was reduced to 27.4% of the prospective current (2.11 kA) when using a 10 µm copper stabilizer.

Funder

Scientific Research Deanship

Publisher

MDPI AG

Subject

Management, Monitoring, Policy and Law,Renewable Energy, Sustainability and the Environment,Geography, Planning and Development,Building and Construction

Reference60 articles.

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