Tangential Ultrasonic-Vibration Assisted Forming Grinding Gear: An Experimental Study

Author:

Bie Wenbo,Zhao Bo,Gao Guofu,Chen Fan,Jin Jiangwei

Abstract

This study used a forming grinding wheel to machine an involute spur gear with ultrasonic vibration applied to the gear in order to improve the gear processing technology and enhance the gear processing effect. Conventional grinding and ultrasonic vibration-assisted forming grinding gear (TUVA-FGG) tests were carried out. The effects of grinding parameters, such as spindle speed, feed rate, radial grinding depth, and ultrasonic amplitude, on grinding force, grinding temperature, residual stress, surface roughness, and surface morphology were analyzed. The TUVA-FGG significantly improved processing efficiency. With the increase in spindle speed, the maximum reductions in the normal and tangential grinding forces, grinding temperature, and surface roughness reached 33.6, 24.5, 23.9, and 21.6%, respectively. With the increase in feed rate, the respective maximum reductions were 21.4, 19.7, 20.3, and 16.1%. With the increase in radial grinding depth, these values attained 24.6, 20.3, 21.5, and 17.6%, respectively. Finally, with the increase in ultrasonic amplitude, these reductions reached 21.4, 19.7, 21.5, and 19.4%. The maximum residual compressive stress grew by 30.3, 27.5, 30.9, and 27.5% with the increase of wheel rotation speed, feed speed, radial grinding depth, and ultrasonic amplitude, respectively. TUVA-FGG changed the conventional continuous cutting mechanism between the abrasive grain and workpiece into intermittent cutting, reducing grinding forces, grinding temperature, and surface roughness. Moreover, it increased residual compressive stress and improved the micromorphology of the tooth surface, thus enhancing gear machining efficiency.

Funder

National Natural Science Foundation of China

Key R&D and Promotion Program (Science and Technology) in Henan Province, China

PhD Research Start-up Fund Project of the Pingdingshan University of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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