Prediction method for residual stress evolution caused by rolling/sliding contact in ultrasonic vibration-assisted grinding

Author:

Ye Shi Jie1,Jun Wen1,Tang Jin Yuan1,Zhou Wei Hua1

Affiliation:

1. Central South University

Abstract

Abstract Ultrasonic vibration-assisted grinding (UVAG) technology has advantages in improving part surface integrity. Currently, the calculation of residual stresses in UVAG typically relies on commercial finite element software. However, because commercial finite element software is not specialized for residual stress calculations, the computational efficiency could be higher, and the accuracy could be better. This paper proposes a semi-analytical residual stress prediction model that considers the Influence of ultrasonic vibration. This paper introduces a semi-analytical residual stress prediction model that considers the impact of ultrasonic vibration. The model calculates the grinding mechanical and thermal stress fields separately using contact mechanics and finite difference methods. Based on Hertz's contact theory and Timoshenko's thermoelastic theory, a correlation model is provided for the association between mechanical and thermal loads with the internal stresses in the workpiece. Subsequently, the residual stress field is solved by considering the thermal-mechanical coupling effects in UVAG. Ultrasonic-assisted grinding experiments were conducted using 12Cr2Ni4A alloy steel as the object, and the maximum error between the predicted residual stresses by the model and the measured residual stresses was 10.5%.In addition, the detailed discussion on the Influence of grinding parameters on residual stress reveals that reducing the grinding wheel speed can significantly increase surface compressive residual stress. The paper's research shows that the residual stress distribution obtained by the new residual stress calculation model is correct, and the calculation efficiency is high, providing a new method for predicting residual stress in UVAG.

Publisher

Research Square Platform LLC

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