Microstructure, Mechanical and Thermal Properties of Al/Cu/SiC Laminated Composites, Fabricated by the ARB and CARB Processes

Author:

Luo Jie1,Khattinejad Rashid2,Assari Amirhossein3,Tayyebi Moslem4ORCID,Hamawandi Bejan5ORCID

Affiliation:

1. School of Mechanical Engineering, Xijing University, Xi’an 710123, China

2. School of Metallurgy and Materials Engineering, Iran University of Science and Technology, Tehran 13114-16846, Iran

3. Department of Material Engineering, Sahand University of Technology, Tabriz 51335-1996, Iran

4. Department of Materials Science and Engineering, Shiraz University of Technology, Modarres Blvd., Shiraz 71557-13876, Iran

5. Department of Applied Physics, KTH Royal Institute of Technology, SE-106 91 Stockholm, Sweden

Abstract

The aim of the current work is to investigate the effect of SiC particle weight percent and rolling passes on Al/Cu/SiC laminated composites, fabricated by accumulative roll-bonding (ARB) and cross-accumulative roll-bonding (CARB) processes. The optical microscopy (OM) images of composites revealed that despite the good bonding of the layers, they underwent plastic instabilities as a consequence of strain hardening of the layers. However, these instabilities occurred more in ARBed composites than in composites fabricated by the CARB process. This is because in the latter process, the composites are rolled in two directions, which leads to better strain distribution. Furthermore, with an increase in passes, SiC particles were well distributed in the matrix and interfaces. The mechanical findings showed that, by increasing passes, there was a growth in the values of strengths and elongation. This behavior is believed to be related to increased work-hardening of layers, better distribution of reinforcing particles, and an enhanced bonding of interfaces at higher rolling passes. In addition, the results of thermal conductivities showed a downward trend with an increase in passes; in fact, the increased number of Al/Cu interfaces declined the heat conduction of composites.

Publisher

MDPI AG

Subject

Inorganic Chemistry,Condensed Matter Physics,General Materials Science,General Chemical Engineering

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