Abstract
This study presents ultra-low-loss and broadband all-silicon dielectric waveguides for the WR-1 band (0.75–1.1 THz). The waveguides are built in high-resistivity silicon (10 kΩ-cm) and integrated with supportive frames fabricated from the same silicon wafer in a single etch process to achieve a compact design. We pursued low-loss, broadband, substrateless, unclad and effective medium waveguides. Smaller propagation losses of 0.3 dB/cm and 0.1 dB/cm were achieved for the unclad and effective medium waveguides, respectively. The 3 dB bandwidth was not encountered in the frequency range of interest and was as broad as 350 GHz. An unclad waveguide was employed to devise a Y-junction to demonstrate its practical applications in terahertz imaging. An integrated circuit card was successfully scanned. In addition, we developed unclad waveguide, effective medium waveguide, and Y-junction modules. The modules incorporated an input/output interface compatible with a standard WR-1 flange (254 μm × 127 μm). Unlike the conventional hollow waveguide modules, the unclad waveguide and effective medium waveguide modules reported total loss improvements of 6 dB and 8 dB, respectively, across the operation band. Our results provided a systematic way of achieving low-loss, compact, and versatile modules in the WR-1 band based on all-dielectric-waveguide platforms.
Funder
Japan Science and Technology Agency
KAKENHI Japan
National Institute of Information and Communications Technology
Subject
Radiology, Nuclear Medicine and imaging,Instrumentation,Atomic and Molecular Physics, and Optics
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献