Transient Liquid Phase Diffusion Bonding of Ni3Al Superalloy with Low-Boron Nickel-Base Powder Interlayer

Author:

Wen Zhifeng1,Li Qi2ORCID,Liu Fengmei2,Dong Yong1,Zhang Yupeng2,Hu Wei3,Li Likun2,Gao Haitao2

Affiliation:

1. School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China

2. China-Ukraine Institute of Welding, Guangdong Academy of Sciences, Guangdong Provincial Key Laboratory of Advanced Welding Technology, Guangzhou 510650, China

3. Songshan Lake Materials Laboratory, Dongguan 523429, China

Abstract

As a technology for micro-deformed solid-phase connection, transient liquid phase (TLP) diffusion bonding plays a key role in the manufacture of heating components of aero engines. However, the harmful brittle phase and high hardness limit the application of TLP diffusion bonding in nickel-based superalloys. In this paper, a new strategy in which a low-boron and high-titanium interlayer can restrain the brittle phase and reduce the hardness of the TLP-diffusion-bonded joint is proposed. With this strategy, the Ni3Al joint can achieve a high strength of 860.84 ± 26.9 MPa under conditions of 1250 °C, 6 h and 5 MPa. The microhardness results show that the average microhardness of the joint area is 420.33 ± 3.15 HV and is only 4.3% higher than that of the Ni3Al base material, which proves that this strategy can effectively inhibit the formation of the harmful brittle phase in the joint area. The results of EBSD show that 7.7% of the twin boundaries exist in the isothermal solidification zone, and only small amounts of secondary precipitates are observed at the grain boundaries in the joint, which indicates that twin boundaries may play a dominant role in crack initiation. This study provides a feasible avenue to suppress the brittle phase in TLP-diffusion-bonded joints.

Funder

GDAS’ Project of Science and Technology Development

National Key Research and Development Program of China

Science and Technology Planning Project of Guangdong Province

Publisher

MDPI AG

Subject

General Materials Science

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