π-Shape ESD Protection Design for Multi-Gbps High-Speed Circuits in CMOS Technology

Author:

Chang Chun-Rong1,Dai Zih-Jyun1,Lin Chun-Yu1ORCID

Affiliation:

1. Department of Electrical Engineering, National Taiwan Normal University, Taipei City 106, Taiwan

Abstract

CMOS integrated circuits are vulnerable to electrostatic discharge (ESD); therefore, ESD protection circuits are needed. On-chip ESD protection is important for both component-level and system-level ESD protection. In this work, on-chip ESD protection circuits for multi-Gbps high-speed applications are studied. π-shaped ESD protection circuit structures realized by staked diodes with an embedded silicon-controlled rectifier (SCR) and resistor-triggered SCR are proposed. These test circuits are fabricated in CMOS technology, and the proposed designs have been proven to have better ESD robustness and performance in high-speed applications.

Funder

National Science and Technology Council, Taiwan

Publisher

MDPI AG

Subject

General Materials Science

Reference23 articles.

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3. Li, J., Chatty, K., Gauthier, R., Mishra, R., and Russ, C. (September, January 30). Technology scaling of advanced bulk CMOS on-chip ESD protection down to the 32 nm node. Proceedings of the 2009 31st EOS/ESD Symposium, Anaheim, CA, USA.

4. (2017). Human Body Model (HBM)—Component Level (Standard No. ANSI/ESDA/JEDEC JS-001-2017).

5. (2008). EMC—Part 4-2: Testing and Measurement Techniques—Electrostatic Discharge Immunity Test (Standard No. IEC 6100-4-2 Standard).

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