Study on Micro-Crack Induced Precision Severing of Quartz Glass Chips
Author:
Publisher
MDPI AG
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Link
http://www.mdpi.com/2072-666X/9/5/224/pdf
Reference23 articles.
1. Development of a scribing wheel for cutting ceramic substrates and its wheel scribing and breaking technology;Tomei;JSAT,2015
2. Effect of scribe-wheel dimensions on the cutting of AMLCD glass substrate
3. Study of cutting quality for TFT-LCD glass substrate
4. In-process estimation of fracture surface morphology during wheel scribing of a glass sheet by high-speed photoelastic observation
5. Vibration assisted scribing process on LCD glass substrate
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