Development of Ternary Ti-Ag-Cu Alloys with Excellent Mechanical Properties and Antibiofilm Activity

Abstract

Titanium-20 mass% Silver (Ti-20%Ag) alloy can suppress biofilm formation on the surface. Unlike bactericidal agents, it does not kill bacteria; therefore, the healthy oral microflora remains undisturbed. To utilize the unique functions of this alloy and enable its use in the fabrication of dental prostheses that require relatively high strength, we added copper (Cu) as an alloying element to improve strength. This study aimed to develop ternary Ti-Ag-Cu alloys with excellent mechanical properties and antibiofilm activity. As a result of investigating the mechanical properties of several experimental alloys, the tensile strength, yield strength, and hardness of Ti-20%Ag-1%Cu and Ti-20%Ag-2%Cu alloys were improved by the solid-solution strengthening or hardening of the αTi phase. In addition, these alloys had the same ability to suppress biofilm formation as the Ti-20Ag alloy. Thus, Ti-20%Ag-1–2%Cu alloys can be used for fabrication of narrow-diameter dental implants and prostheses subjected to extremely high force, and these prostheses are useful in preventing post-treatment oral diseases.