Digital Platform for Wafer-Level MEMS Testing and Characterization Using Electrical Response-Reference-Cited by-同舟云学术

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Digital Platform for Wafer-Level MEMS Testing and Characterization Using Electrical Response

Published:2016-09-21 Issue:9 Volume:16 Page:1553
ISSN:1424-8220
Container-title:Sensors
language:en
Short-container-title:Sensors

Author:

Brito Nuno^ORCID,Ferreira Carlos,Alves Filipe,Cabral Jorge,Gaspar João,Monteiro João,Rocha Luís

Funder

FCT - Fundação para a Ciência e Tecnologia

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Link

http://www.mdpi.com/1424-8220/16/9/1553/pdf

Reference20 articles.

1. A Review on Key Issues and Challenges in Devices Level MEMS Testing

2. System on Chip Test Architectures;Ramadoss,2008

3. MEMS reliability;Hartzell,2011

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Active Probe Card for Multi-Parameter Fast Characterization of Mems Gyroscope at Wafer-Level;2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL);2024-03-25

2. Characterization of the dynamics of encapsulated silicon MEMS devices using low-coherence heterodyne LDV technology;Micro and Nano Engineering;2023-06

3. Towards Reliable Parameter Extraction in MEMS Final Module Testing Using Bayesian Inference;Sensors;2022-07-20

4. Frequency Induced Stiction for MEMS Accelerometers;Journal of Microelectromechanical Systems;2020-06

5. A New Non-Invasive Air-Based Actuator for Characterizing and Testing MEMS Devices;Actuators;2020-03-31

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