A Numerical Model of a Perforated Microcantilever Covered with Cardiomyocytes to Improve the Performance of the Microcantilever Sensor

Author:

Qiu Bin,Li Guangyong,Du Jianke,Zhang Aibing,Jin Yuan

Abstract

A few simple polymeric microsystems, such as microcantilever sensors, have recently been developed for the preliminary screening of cardiac toxicity. The microcantilever deflection produced by a change in the cardiomyocyte (CM) contraction force is important for understanding the mechanism of heart failure. In this study, a new numerical model is proposed to analyze the contractile behavior of CMs cultured on a perforated microcantilever surface for improving the performance of the microcantilever sensor. First, the surface traction model is used to investigate the bending displacement of the plain microcantilever. In order to improve the bending effect, a new numerical model is developed to analyze the bending behavior of the perforated microcantilever covered with CMs. Compared with the designed molds, the latter yields better results. Finally, a simulation analysis is proposed based on a finite element method to verify the presence of a preformed mold. Moreover, the effects of various factors on the bending displacement, including microcantilever size, Young’s modulus, and porosity factor, are investigated. Both the simulation and numerical results have good consistency, and the maximum error between the numerical and simulation results is not more than 3.4%, even though the porosity factor reaches 0.147. The results show that the developed mold opens new avenues for CM microcantilever sensors to detect cardiac toxicity.

Publisher

MDPI AG

Subject

General Materials Science

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Elastomeric platform with surface wrinkling patterns to control cardiac cell alignment;Journal of Biomedical Materials Research Part A;2023-02-10

2. Comparative study of perforated microcantilevers for MEMS applications;2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP);2021-08-25

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