Direct Laser Interference Ink Printing Using Copper Metal–Organic Decomposition Ink for Nanofabrication

Abstract

In this study, we developed an effective and rapid process for nanoscale ink printing, direct laser interference ink printing (DLIIP), which involves the photothermal reaction of a copper-based metal–organic decomposition ink. A periodically lined copper pattern with a width of 500 nm was printed on a 240 μm-wide line at a fabrication speed of 17 mm/s under an ambient environment and without any pre- or post-processing steps. This pattern had a resistivity of 3.5 μΩ∙cm, and it was found to exhibit a low oxidation state that was twice as high as that of bulk copper. These results demonstrate the feasibility of DLIIP for nanoscale copper printing with fine electrical characteristics.