Key Aspects of the Processes of Thermal Decomposition of Complex Compounds of Copper Formate for Low-Temperature Printed Electronics-Reference-Cited by-同舟云学术

Key Aspects of the Processes of Thermal Decomposition of Complex Compounds of Copper Formate for Low-Temperature Printed Electronics

Published:2023-06-09 Issue:6 Volume:5 Page:3215-3223
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Nabi Shabanov¹^ORCID,Suleymanov Sagim¹²,Amirov Akhmed¹,Ataev Mansur¹,Isaev Abdulgalim²,Chiolerio Alessandro³^ORCID,Magomedov Kurban E.²^ORCID,Gadzhimagomedov Sultanahmed²,Emirov Ruslan Muradovich²

Affiliation:

1. Institute of Physics, Dagestan Scientific Center, Russian Academy of Sciences, Yaragskogo Str. 94, 367003 Makhachkala, Russian Federation

2. Dagestan State University, Gadzhiyev Str. 43-a, 367000 Makhachkala, Russian Federation

3. Bioinspired Soft Robotics, Center for Converging Technologies, Istituto Italiano di Tecnologia, Via Morego 30, 16165 Genova, Italy

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaelm.3c00281

Reference55 articles.

1. POLED displays: Robust printing of pixels

2. Inkjet-Printed Mesoporous TiO2 and Perovskite Layers for High Efficiency Perovskite Solar Cells

3. Highly Customizable All Solution–Processed Polymer Light Emitting Diodes with Inkjet Printed Ag and Transfer Printed Conductive Polymer Electrodes

4. Temperature sensor realized by inkjet printing process on flexible substrate

5. Inkjet-Printed Vertical Organic Field-Effect Transistor Arrays and Their Image Sensors

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1. Key Aspects of the Processes of Thermal Decomposition of Complex Compounds of Copper Formate for Low-Temperature Printed Electronics. II. The Solvent Effect;ACS Applied Electronic Materials;2023-08-10