Effect of the Addition of Nano-Silica and Poly(ε-caprolactone) on the Mechanical and Thermal Properties of Poly(lactic acid) Blends and Possible Application in Embossing Process

Author:

Mahović Poljaček SanjaORCID,Priselac DinoORCID,Tomašegović TamaraORCID,Elesini Urška StankovićORCID,Leskovšek MirjamORCID,Leskovac MirelaORCID

Abstract

In this study, the mechanical and thermal properties of poly(lactic acid) (PLA) blends with an addition of poly(ε–caprolactone) (PCL) and fumed silica (SiO2) were evaluated to research the possibility of their use as relief printing plates for embossing processes. PCL and nano-silica were added to the PLA matrix at different concentrations. Morphological, thermal and mechanical analyses were performed to determine the properties and possible functional characteristics of the studied blends. SEM micrographs showed that unmodified PLA/PCL blends exhibit a morphology typical of incompatible blends with clearly visible spherical domains of dispersed PCL in PLA. In particular, the results of the hardness tests showed that the selected blends have the optimal hardness (between 65 SH D and 75 SH D) for use in the embossing process. The tensile tests showed that the addition of nano-silica to neat PLA and to the PLA/PCL blends 50/50 and 60/40 improved the mechanical properties of the blends, especially stiffness and toughness. The DMA results showed that the addition of smaller amounts of SiO2 can contribute to an increase in storage modulus, which is due to good dispersion and distribution of SiO2 in the matrix. DSC analysis showed that the addition of PCL to PLA polymer increased the thermal stability of PLA and that the addition of nano-silica increased the degree of crystallinity of PLA. The TGA results showed that the addition of nano-silica improved the thermal degradation behavior of the studied blends, especially for blends modified with 3 wt% nano-silica. The results show that it is possible to optimize the mechanical and thermal properties of the blends with the aim of using them in the embossing process.

Publisher

MDPI AG

Subject

Polymers and Plastics,General Chemistry

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