A Combined Thin Film/Thick Film Approach to Realize an Aluminum-Based Strain Gauge Sensor for Integration in Aluminum Castings

Author:

Tiedemann Rico,Lepke Dennis,Fischer Martin,Pille Christoph,Busse Matthias,Lang Walter

Abstract

There is currently a large demand for aluminum components to measure the mechanical and thermal loads to which they are subjected. With structural health monitoring, components in planes, vehicles, or bridges can monitor critical loads and potentially prevent an impending fatigue failure. Externally attached sensors need a structural model to obtain knowledge of the mechanical load at the point of interest, whereas embedded sensors can be used for direct measurement at the point of interest. To produce an embedded sensor, which is automatically encapsulated against environmental influence, the sensor must be able to withstand the boundary conditions of the host component’s manufacturing process. This embedding process is particularly demanding in the case of casting. Previous work showed that silicon-based sensors have a high failure rate when embedded in cast aluminum parts and that using aluminum as a substrate is preferable under these circumstances. In the present paper, we present the fabrication process for the combination of a thick-film insulation and a thin-film strain gauge sensor, on such an aluminum substrate. The sensor is capable of withstanding high temperatures of at least 600 °C for over 20 min and a subsequent embedding in a gravity die casting process.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3