Improvement of Dynamic On-Resistance in GaN-Based Devices with a High-Quality In Situ SiN Passivation Layer
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Published:2023-06-10
Issue:6
Volume:14
Page:1227
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ISSN:2072-666X
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Container-title:Micromachines
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language:en
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Short-container-title:Micromachines
Author:
Kim Jeong-Gil1, Lee Jun-Hyeok2, Kang Dong-Min1, Lee Jung-Hee3
Affiliation:
1. Terrestrial & Non-Terrestrial Integrated Telecommunications Research Laboratory, Electronics and Telecommunications Research Institute, Daejeon 34129, Republic of Korea 2. GaN Part, DB-Hitek, Eumseong 27605, Republic of Korea 3. L&D Inc., Daegu 34138, Republic of Korea
Abstract
In this paper, we compared the characteristics of normally-on/off AlGaN/GaN MISHEMTs passivated by an in situ/ex situ SiN layer. The devices passivated by the in situ SiN layer revealed enhanced DC characteristics, such as the drain current of 595 mA/mm (normally-on) and 175 mA/mm (normally-off) with the high on/off current ratio of ~107, respectively, compared with those of the devices passivated by the ex situ SiN layer. The MISHEMTs passivated by the in situ SiN layer also exhibited a much lower increase of dynamic on-resistance (RON) of 4.1% for the normally-on device and 12.8% for the normally-off device, respectively. Furthermore, the breakdown characteristics are greatly improved by employing the in situ SiN passivation layer, suggesting that the in situ SiN passivation layer can remarkably not only suppress the surface-trapping effects, but also decrease the off-state leakage current in the GaN-based power devices.
Funder
Institute of Information & communications Technology Planning & Evaluation
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
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