Thermal, Morphological, Electrical Properties and Touch-Sensor Application of Conductive Carbon Black-Filled Polyamide Composites

Author:

Brunella ValentinaORCID,Rossatto Beatrice Gaia,Scarano DomenicaORCID,Cesano FedericoORCID

Abstract

Polyamide 66 (PA66) is a well-known engineering thermoplastic polymer, primarily employed in polymer composites with fillers and additives of different nature and dimensionality (1D, 2D and 3D) used as alternatives to metals in various technological applications. In this work, carbon black (CB), a conductive nanofiller, was used to reinforce the PA66 polymer in the 9–27 wt. % CB loading range. The reason for choosing CB was intrinsically associated with its nature: a nanostructured carbon filler, whose agglomeration characteristics affect the electrical properties of the polymer composites. Crystallinity, phase composition, thermal behaviour, morphology, microstructure, and electrical conductivity, which are all properties engendered by nanofiller dispersion in the polymer, were investigated using thermal analyses (thermogravimetry and differential scanning calorimetry), microscopies (scanning electron and atomic force microscopies), and electrical conductivity measurements. Interestingly, direct current (DC) electrical measurements and conductive-AFM mapping through the samples enable visualization of the percolation paths and the ability of CB nanoparticles to form aggregates that work as conductive electrical pathways beyond the electrical percolation threshold. This finding provides the opportunities to investigate the degree of filler dispersion occurring during the transformation processes, while the results of the electrical properties also contribute to enabling the use of such conductive composites in sensor and device applications. In this regard, the results presented in this paper provide evidence that conductive carbon-filled polymer composites can work as touch sensors when they are connected with conventional low-power electronics and controlled by inexpensive and commercially available microcontrollers.

Publisher

MDPI AG

Subject

General Materials Science,General Chemical Engineering

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