Affiliation:
1. Department of Semiconductor Engineering, Seoul National University of Science & Technology, Seoul 01811, Republic of Korea
Abstract
This paper presents an innovative approach to alleviate Z-interference in 3D NAND flash memory by proposing an optimized confined nitride trap layer structure. Z-interference poses a significant challenge in 3D NAND flash memory, especially with the reduction in cell spacing to accommodate an increased number of vertically stacked 3D NAND flash memories. While the confined nitride trap layer device designed for complete isolation of the trapping layer in three dimensions effectively reduces Z-interference, the results showed substantial variations based on the confined structure. To clarify this issue, we compared three distinct confined nitride trap layer structures and investigated their impact on Z-interference. Our findings indicate that the rectangle structure exhibited the most significant mitigation, implying that differences in the electric field applied to the poly silicon channel, which is influenced by the structure, and the increase in effective channel length are effective strategies for alleviating Z-interference. The proposed structure undergoes a comprehensive examination through technology computer-aided design (TCAD) simulations. Additionally, we introduce a practical process flow designed to minimize Z-interference.
Reference20 articles.
1. The Fundamentals of NAND Flash Memory: Technology for tomorrow’s fourth industrial revolution;Yoon;IEEE Solid-State Circuits Mag.,2022
2. Aochi, H. (2009, January 10–14). BiCS flash as a future 3D non-volatile memory technology for ultra high density storage devices. Proceedings of the 2009 IEEE International Memory Workshop (IMW), Monterey, CA, USA.
3. Jang, J., Kim, H.-S., Cho, W., Cho, H., Kim, J., Shim, S.I., Jeong, J.-H., Son, B.-K., and Kim, D.W. (2009, January 15–17). Vertical cell array using TCAT(terabit cell array transistor) technology for ultra high density NAND flash memory. Proceedings of the 2019 Symposium on VLSI Technology, Kyoto, Japan.
4. 3-D NAND Technology Achievements and Future Scaling Perspectives;Goda;IEEE Trans. Electron Devices,2020
5. Three-Dimensional NAND Flash Memory Based on Single-Crystalline Channel Stacked Array;Kim;IEEE Electron Device Lett.,2013
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献