Effect of Proton Irradiation on Complementary Metal Oxide Semiconductor (CMOS) Single-Photon Avalanche Diodes

Author:

Xun Mingzhu123,Li Yudong12,Feng Jie12,He Chengfa12,Liu Mingyu123,Guo Qi12

Affiliation:

1. Xinjiang Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Urumqi 830011, China

2. Xinjiang Key Laboratory of Electronic Information Material and Device, Urumqi 830011, China

3. University of Chinese Academy of Sciences, Beijing 100049, China

Abstract

The effects of proton irradiation on CMOS Single-Photon Avalanche Diodes (SPADs) are investigated in this article. The I–V characteristics, dark count rate (DCR), and photon detection probability (PDP) of the CMOS SPADs were measured under 30 MeV and 52 MeV proton irradiations. Two types of SPAD, with and without shallow trench isolation (STI), were designed. According to the experimental results, the leakage current, breakdown voltage, and PDP did not change after irradiation at a DDD of 2.82 × 108 MeV/g, but the DCR increased significantly at five different higher voltages. The DCR increased by 506 cps at an excess voltage of 2 V and 10,846 cps at 10 V after 30 MeV proton irradiation. A γ irradiation was conducted with a TID of 10 krad (Si). The DCR after the γ irradiation increased from 256 cps to 336 cps at an excess voltage of 10 V. The comparison of the DCR after proton and γ-ray irradiation with two structures of SPAD indicates that the major increase in the DCR was due to the depletion region defects caused by proton displacement damage rather than the Si-SiO2 interface trap generated by ionization.

Funder

West Light Talent Training Plan of the Chinese Academy of Sciences

Tianshan Innovation Team Program of Xinjiang Uygur Autonomous Region

Fund of Robot Technology Used for Special Environment Key Laboratory of Sichuan Province

Chinese Academy of Sciences

Publisher

MDPI AG

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