Abstract
System-level radiation testing of electronics is evaluated, based on test examples of the System-in-Package (SiP) module irradiations. Total ionizing dose and single event effects tests are analyzed to better understand the opportunities and limitations of the system-level approach in the context of the radiation qualification of electronics. Impact on the SiP product development is discussed.
Funder
European Union
Occitanie Region and the EU via ERDF funds
Subject
Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering
Cited by
7 articles.
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