A Multichannel, High-Bandwidth Wirelane Receiver for D2D Interconnects

Abstract

This paper proposes a multichannel and high-bandwidth (BW) receiver for standard packaging die-to-die (D2D) interconnects. The receiver adopts forward clock (FCK) architecture of the high-density transmission standard, which consists of 16 high-speed data paths and a pair of low-speed differential clocks for 512 Gbps BW. To reduce the chip area and power consumption, a common minimal phase-locked loop (MINI-PLL) and data adjustment (CDA) circuit to replaces the clock data recovery circuit (CDR) in the traditional receiver. A delay-matching circuit is adopted to combat PVT variation and lane skew. In addition, a high linearity phase interpolator (PI) circuit design is used in the minimum phase-locked loop (MINI-PLL) to adjust the clock phase and improve the clock jitter performance. Using 28 nm CMOS technology, the overall link power consumption is 1.56 pJ/b. Bit error rate (BER) is less than 10−15 under the real S-parameters with a channel loss of 10db@16GHz.