A Novel Approach to Optimizing Grinding Parameters in the Parallel Grinding Process

Author:

Yin Tengfei1,Zhang Hanqian23,Hang Wei4ORCID,To Suet1ORCID

Affiliation:

1. State Key Laboratory of Ultra-Precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China

2. Guangzhou Haozhi Industrial Co., Ltd., Guangzhou 511356, China

3. School of Mechanical Engineering and Automation, Harbin Institute of Technology, Shenzhen 518055, China

4. College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China

Abstract

Hard materials have found extensive applications in the fields of electronics, optics, and semiconductors. Parallel grinding is a common method for fabricating high-quality surfaces on hard materials with high efficiency. However, the surface generation mechanism has not been fully understood, resulting in a lack of an optimization approach for parallel grinding. In this study, the surface profile formation processes were analyzed under different grinding conditions. Then, a novel method was proposed to improve surface finish in parallel grinding, and grinding experiments were carried out to validate the proposed approach. It was found that the denominator (b) of the simplest form of the rotational speed ratio of the grinding wheel to the workpiece has a great influence on surface generation. The surface finish can be optimized without sacrificing the machining efficiency by slightly adjusting the rotational speeds of the wheel or the workpiece to make the value of b close to the ratio (p) of the wheel contact width to the cross-feed distance per workpiece revolution. Overall, this study provides a novel approach for optimizing the parallel grinding process, which can be applied to industrial applications.

Funder

National Key Research and Development Program of China

International Science and Technology Cooperation Project of Guangzhou Development District/Huangpu District

State Key Laboratories in Hong Kong from the Innovation and Technology Commission (ITC) of the Government of the Hong Kong Special Administrative Region (HKSAR), China

Research Committee of The Hong Kong Polytechnic University

Publisher

MDPI AG

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