Material Extrusion 3D Printing of PEEK-Based Composites

Author:

Hanemann Thomas12ORCID,Klein Alexander1,Baumgärtner Siegfried1,Jung Judith1,Wilhelm David1,Antusch Steffen1ORCID

Affiliation:

1. Institute for Applied Materials, Karlsruhe Institute of Technology, Hermann-von-Helmholtz-Platz 1, D-76344 Eggenstein-Leopoldshafen, Germany

2. Department of Microsystems Engineering, University Freiburg, Georges-Koehler-Allee 102, D-79110 Freiburg, Germany

Abstract

High-performance thermoplastics like polyetheretherketone (PEEK), with their outstanding thermal stability, mechanical properties and chemical stability, have great potential for various structural applications. Combining with additive manufacturing methods extends further PEEK usage, e.g., as a mold insert material in polymer melt processing like injection molding. Mold inserts must possess a certain mechanical stability, a low surface roughness as well as a good thermal conductivity for the temperature control during the molding process. With this in mind, the commercially available high-performance thermoplastic PEEK was doped with small amounts of carbon nanotubes (CNT, 6 wt%) and copper particles (10 wt%) targeting enhanced thermomechanical properties and a higher thermal conductivity. The composites were realized by a commercial combined compounder and filament maker for the usage in a material extrusion (MEX)-based 3D-printer following the fused filament fabrication (FFF) principle. Commercial filaments made from PEEK and carbon fiber reinforced PEEK were used as reference systems. The impact of the filler and the MEX printing conditions like printing temperature, printing speed and infill orientation on the PEEK properties were characterized comprehensively by tensile testing, fracture imaging and surface roughness measurements. In addition, the thermal conductivity was determined by the laser-flash method in combination with differential scanning calorimetry and Archimedes density measurement. The addition of fillers did not alter the measured tensile strength in comparison to pure PEEK significantly. The fracture images showed a good printing quality without the MEX-typical voids between and within the deposited layers. Higher printing temperatures caused a reduction of the surface roughness and, in some cases, an enhanced ductile behavior. The thermal conductivity could be increased by the addition of the CNTs. Following the given results, the most critical process step is the compounding procedure, because for a reliable process–parameter–property relationship, a homogeneous particle distribution in the polymer matrix yielding a reliable filament quality is essential.

Funder

publication fund of the Karlsruhe Institute of Technology

Publisher

MDPI AG

Subject

Polymers and Plastics,General Chemistry

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