Material-Dependent Effect of Common Printing Parameters on Residual Stress and Warpage Deformation in 3D Printing: A Comprehensive Finite Element Analysis Study

Author:

Alzyod Hussein1ORCID,Ficzere Peter1

Affiliation:

1. Department of Railway Vehicles and Vehicle System Analysis, Faculty of Transportation Engineering and Vehicle Engineering, Budapest University of Technology and Economics, Műegyetem rkp.3, H-1111 Budapest, Hungary

Abstract

Additive manufacturing (AM), commonly known as 3D printing, has gained significant popularity for its ability to produce intricate parts with high precision. However, the presence of residual stresses and warpage deformation are common issues affecting the quality and functionality of 3D-printed parts. This study conducts a comprehensive finite element analysis (FEA) to investigate the material-dependent impact of key printing parameters on residual stress and warpage deformation in 3D printing. The research focuses on three distinct materials: polyetherimide (PEI), acrylonitrile butadiene styrene (ABS), and polyamide 6 (PA6). Various printing parameters are systematically varied, including printing temperature, printing speed, bed temperature, infill density, layer thickness, and infill pattern. The study employs the Taguchi L27 orthogonal array and employs the analysis of variance (ANOVA) statistical technique to assess the significance of the input parameters. The obtained results reveal that certain parameters exhibit a greater sensitivity to material differences, whereas the layer thickness parameter demonstrates a relatively lower sensitivity. Notably, infill density and printing temperature play a crucial role in reducing residual stress for PA6, while the infill pattern parameter proves to be a significant contributor to minimizing warpage deformation across all three materials. These findings underscore the importance of conducting material-specific analyses to optimize 3D printing parameters and achieve the desired quality outcomes while mitigating residual stress and warpage deformation.

Publisher

MDPI AG

Subject

Polymers and Plastics,General Chemistry

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