Direct Numerical Simulation of Surface Wrinkling for Extraction of Thin Metal Film Material Properties

Author:

Seok Seonho1ORCID,Park HyungDal2ORCID,Coste Philippe1,Kim Jinseok2

Affiliation:

1. Center for Nanoscience and Nanotechnology (C2N), University-Paris-Saclay, 91400 Orsay, France

2. Center for Bionics, Korea Institute of Science and Technology (KIST), Seongbuk-gu, Seoul 02792, Republic of Korea

Abstract

This paper presents a direct numerical simulation for the extraction of material properties based on thin-film wrinkling on scotch tape. Conventional FEM-based buckling simulation sometimes requires complex modeling techniques concerning mesh element manipulation or boundary conditions. The direct numerical simulation differs from FEM (finite element method)-based conventional two-step linear–nonlinear buckling simulation in that mechanical imperfections are directly applied into the elements of the simulation model. Hence, it can be performed in one step to find the wrinkling wavelength and amplitude, which are key parameters to extract the material mechanical properties. Moreover, the direct simulation can reduce simulation time and modeling complexity. Using the direct model, the effect of the number of imperfections on wrinkling characteristics was first studied, and then wrinkling wavelengths depending on the elastic moduli of the associated materials were prepared for the extraction of material properties. Thin-film wrinkling test patterns on scotch tape were fabricated using the transfer technique with low adhesion between metal films and the polyimide substrate. The material properties of the thin metal films were determined by comparing the measured wrinkling wavelengths and the proposed direct simulation results. By consequence, the elastic moduli of 300 nm thick gold film and 300 nm thick aluminum were determined as 250 GPa and 300 GPa, respectively.

Funder

Korean government

Ministry of Science and ICT

Korea Institute of Science and Technology

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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