Pressure Driven Rapid Reconfigurable Liquid Metal Patterning

Author:

Liu Bingxin12,Qin Peng12,Liu Mingyang3,Liu Wei3,Zhang Pan12,Ye Zi1,Deng Zhongshan12,Li Zhenming3,Gui Lin12

Affiliation:

1. CAS Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China

2. School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China

3. Energy Storage and Novel Technology of Electrical Engineering Department, China Electric Power Research Institute, Beijing 100192, China

Abstract

This paper proposes a method for pressure driven rapid reconfigurable liquid metal patterning. A sandwich structure of “pattern—film—cavity” is designed to complete this function. Both sides of the highly elastic polymer film are bonded with two PDMS slabs. One PDMS slab has microchannels patterned on the surface. The other PDMS slab has a large cavity on its surface for liquid metal storage. These two PDMS slabs are bonded together, face to face, with the polymer film in the middle. In order to control the distribution of the liquid metal in the microfluidic chip, the elastic film will deform under the high pressure of the working medium in the microchannels and then extrude the liquid metal into different patterns in the cavity. This paper studies the factors of liquid metal patterning in detail, including external control conditions, such as the type and pressure of the working medium and the critical dimensions of the chip structure. Moreover, both a single-pattern and a double-pattern chip are fabricated in this paper, which can form or reconfigure the liquid metal pattern within 800 ms. Based on the above methods, reconfigurable antennas of two frequencies are designed and fabricated. Meanwhile, their performance is simulated and tested by simulation and vector network tests. The operating frequencies of the two antennas are respectively significantly switching between 4.66 GHz and 9.97 GHz.

Funder

the Science and Technology Program from State Grid Corporation of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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