Application of multi-fidelity simulation modelling to integrated circuit packaging
Author:
Publisher
Inderscience Publishers
Subject
Applied Mathematics,Computer Science Applications,Modeling and Simulation
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Improved multi-fidelity simulation-based optimisation: application in a digital twin shop floor;International Journal of Production Research;2020-12-02
2. Effiziente Initialisierung von Steuerungsparametern für Cyber-Physische Produktionssysteme via Multi-Ebenen-Optimierung;at - Automatisierungstechnik;2019-06-01
3. Optimal Parallel Machine Allocation Problem in IC Packaging Using IC-PSO: An Empirical Study;Asia-Pacific Journal of Operational Research;2017-12
4. A multi-granularity approach for estimating the sustainability of a factory simulation model: semiconductor packaging as an example;Operational Research;2017-08-21
5. Simulating a Semiconductor Packaging Facility: Sustainable Strategies and Short-time Evidences;Procedia Manufacturing;2017
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