Three-Dimensional Electromechanical Impedance Model. I: Formulation of Directional Sum Impedance-Reference-Cited by-同舟云学术

Three-Dimensional Electromechanical Impedance Model. I: Formulation of Directional Sum Impedance

Published:2007-01 Issue:1 Volume:20 Page:53-62
ISSN:0893-1321
Container-title:Journal of Aerospace Engineering
language:en
Short-container-title:J. Aerosp. Eng.

Author:

Annamdas Venu Gopal Madhav¹²,Soh Chee Kiong¹²

Affiliation:

1. Research Scholar, Division of Structures and Mechanics, School of Civil and Environmental Engineering, Nanyang Technological Univ., 50 Nanyang Ave., Singapore 639798, Singapore. E-mail: vgmadhav@pmail.ntu.edu.sg

2. Professor, Division of Structures and Mechanics, School of Civil and Environmental Engineering, Nanyang Technological Univ., 50 Nanyang Ave., Singapore 639798, Singapore (corresponding author). E-mail: csohck@ntu.edu.sg

Publisher

American Society of Civil Engineers (ASCE)

Subject

Mechanical Engineering,Aerospace Engineering,General Materials Science,Civil and Structural Engineering

Link

http://ascelibrary.org/doi/pdf/10.1061/%28ASCE%290893-1321%282007%2920%3A1%2853%29

Reference14 articles.

1. Structural Health Monitoring by Piezo-Impedance Transducers. I: Modeling

2. Use of piezoelectric actuators as elements of intelligent structures

3. Experimental Investigation of E/M Impedance Health Monitoring for Spot-Welded Structural Joints

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