High‐performance poly(methylsilane arylether arylacetylene) resins with low curing temperatures and weak secondary relaxations

Abstract

AbstractA series of poly(methylsilane arylether arylacetylene) (PSEA‐H) resins were synthesized from methyldichlorosilane and isomeric arylether arylacetylenes, and characterized by 1H‐NMR and FT‐IR spectroscopies. The effect of reactive Si‐H groups and the linking positions of benzene rings in the arylether arylacetylene units on the properties of the resins were investigated. The results show that PSEA‐H resins possess good processability with processing windows of over 80°C. The introduction of Si‐H groups reduces the curing temperatures for PSEA‐H resins and weakens the secondary relaxation for the cured PSEA‐H resins. The cured resins and T300 carbon fiber (T300CF) reinforced composites display high mechanical properties. The flexural strengths of a cured PSEA‐H resin and its T300CF composite at room temperature reach 64.2 and 426.5 MPa, respectively. The flexural properties depend on the linking positions of benzene rings. The cured PSEA‐H resins show excellent heat resistance with a temperature of 5% weight loss (Td5) above 500°C.