Dynamics and thermal properties of epoxy resin cured by new diamino disiloxanes-Reference-Cited by-同舟云学术

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Dynamics and thermal properties of epoxy resin cured by new diamino disiloxanes

Published:2015-05-27 Issue:33 Volume:132 Page:n/a-n/a
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Shi Xinxiu¹,Lin Xiankai²³,Xu Caihong²,Cui Mengzhong¹

Affiliation:

1. Chemistry & Chemical Engineering College, Yantai University; Yantai 264005 China

2. Center for Molecular Science; Institute of Chemistry, Chinese Academy of Sciences; Beijing 100190 China

3. Graduate School of Chinese Academy of Sciences; Beijing 100049 China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference30 articles.

1. Kinetics study of thermal decomposition of electronic packaging material

2. Assessing optimal growth of desired species in epoxy polymerization under uncertainty

3. Epoxy resins modified with reactive low molecular weight siloxanes

4. The influence of the processing temperature on gamma curing of epoxy resins for the production of advanced composites

5. Studies on the adhesive properties of solid elastomer-modified novolac epoxy resin

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1. POLYMERS AND THEIR CURATIVES;Handbook of Curatives and Crosslinkers;2024

2. Study of the Effects of Doping Alkali Metal Ions on Cross-Linked Network of Epoxy Resins and Analysis of Insulation Properties;Journal of Electronic Materials;2022-03-19

3. Thermo-mechanical properties and morphology of epoxy resins with co-poly (phthalazinone ether nitrile);Journal of Polymer Research;2019-03-25

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