Subject
Industrial and Manufacturing Engineering,General Chemical Engineering,Environmental Chemistry,General Chemistry
Reference24 articles.
1. Pyrolysis-based material recovery from molding resin for electronic parts;Iji;J. Environ. Eng.,1998
2. K. Arai, K. Tomikichi, T. Shiohara, Epoxy resin composition with good flowability, storage stability, and curability and semiconductor device sealed with it, Patent JP 11263826 A2 (1999).
3. Thermal degradation of epoxy/silica composites monitored via dynamic mechanical thermal analysis;Unsworth;J. Appl. Polym. Sci.,1992
4. Thermogravimetric study of amine cross-linked epoxies;Bellenger;Polym. Degrad. Stab.,1984
5. Low-temperature thermal decomposition of an epoxy resin;Grayson;J. Polym. Sci.,1984
Cited by
51 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献