Direct Synthesis of Layer‐Tunable and Transfer‐Free Graphene on Device‐Compatible Substrates Using Ion Implantation Toward Versatile Applications

Author:

Wang Bingkun1,Jiang Jun2,Baldwin Kevin3,Wu Huijuan1,Zheng Li4,Gong Mingming5,Ju Xuehai26,Wang Gang14ORCID,Ye Caichao56ORCID,Wang Yongqiang37

Affiliation:

1. Department of Microelectronic Science and Engineering, School of Physical Science and Technology Ningbo University Ningbo 315211 China

2. Key Laboratory of Soft Chemistry and Functional Materials of MOE, School of Chemistry and Chemical Engineering Nanjing University of Science and Technology Nanjing 210094 China

3. Center for Integrated Nanotechnologies Los Alamos National Laboratory Los Alamos 87545 New Mexico USA

4. National Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology Chinese Academy of Sciences Shanghai 200050 China

5. Academy for Advanced Interdisciplinary Studies & Department of Materials Science and Engineering Southern University of Science and Technology Shenzhen 518055 China

6. Guangdong Provincial Key Laboratory of Computational Science and Material Design Southern University of Science and Technology Shenzhen 518055 China

7. Materials Science and Technology Division Los Alamos National Laboratory Los Alamos 87545 New Mexico USA

Abstract

Direct synthesis of layer‐tunable and transfer‐free graphene on technologically important substrates is highly valued for various electronics and device applications. State of the art in the field is currently a two‐step process: a high‐quality graphene layer synthesis on metal substrate through chemical vapor deposition (CVD) followed by delicate layer transfer onto device‐relevant substrates. Here, we report a novel synthesis approach combining ion implantation for a precise graphene layer control and dual‐metal smart Janus substrate for a diffusion‐limiting graphene formation to directly synthesize large area, high quality, and layer‐tunable graphene films on arbitrary substrates without the post‐synthesis layer transfer process. Carbon (C) ion implantation was performed on Cu–Ni film deposited on a variety of device‐relevant substrates. A well‐controlled number of layers of graphene, primarily monolayer and bilayer, is precisely controlled by the equivalent fluence of the implanted C‐atoms (1 monolayer ~4 × 1015 C‐atoms/cm2). Upon thermal annealing to promote Cu‐Ni alloying, the pre‐implanted C‐atoms in the Ni layer are pushed toward the Ni/substrate interface by the top Cu layer due to the poor C‐solubility in Cu. As a result, the expelled C‐atoms precipitate into a graphene structure at the interface facilitated by the Cu‐like alloy catalysis. After removing the alloyed Cu‐like surface layer, the layer‐tunable graphene on the desired substrate is directly realized. The layer‐selectivity, high quality, and uniformity of the graphene films are not only confirmed with detailed characterizations using a suite of surface analysis techniques but more importantly are successfully demonstrated by the excellent properties and performance of several devices directly fabricated from these graphene films. Molecular dynamics (MD) simulations using the reactive force field (ReaxFF) were performed to elucidate the graphene formation mechanisms in this novel synthesis approach. With the wide use of ion implantation technology in the microelectronics industry, this novel graphene synthesis approach with precise layer‐tunability and transfer‐free processing has the promise to advance efficient graphene‐device manufacturing and expedite their versatile applications in many fields.

Funder

Basic and Applied Basic Research Foundation of Guangdong Province

Guangdong Provincial Key Laboratory of Computational Science and Material Design

Publisher

Wiley

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