Low‐temperature curable, alkaline‐developable, and negative‐type photosensitive polyimide with high resolution and mechanical properties based on chain extendable poly(amic acid) and photo‐base generator-Reference-Cited by-同舟云学术

Low‐temperature curable, alkaline‐developable, and negative‐type photosensitive polyimide with high resolution and mechanical properties based on chain extendable poly(amic acid) and photo‐base generator

Published:2020-10-19 Issue:2 Volume:32 Page:663-669
ISSN:1042-7147
Container-title:Polymers for Advanced Technologies
language:en
Short-container-title:Polym Adv Technol

Author:

Yeh Yao‐Ming¹,Karapala Vamsi K.¹,Ueda Mitsuru¹²,Hsu Chain‐Shu¹³^ORCID

Affiliation:

1. Department of Applied Chemistry National Chiao Tung University Hsinchu Taiwan

2. Department of Organic and Polymeric materials Tokyo Institute of Technology Tokyo Japan

3. Center for Emergent Functional Matter Science National Chiao Tung University Hsinchu Taiwan

Funder

National Chiao Tung University

Ministry of Science and Technology, Taiwan

Publisher

Wiley

Subject

Polymers and Plastics

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pat.5119

Reference24 articles.

1. Recent progress in thermally stable and photosensitive polymers

2. Photosensitive engineering plastics based on reaction development patterning

3. Low temperature curable photosensitive polyimides for preventing curling and cracking from FO‐WLP;Tomikawa M;Mater Stage,2017

4. Photosensitive polyimide: its molecular design and refractive index control technologies;Tomikawa M;Kino Zairyo,2015

5. The Design of Photosensitive Polyimide Materials for Buffer Coating Processes

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