Study on the properties of the epoxy-matrix composites filled with thermally conductive AlN and BN ceramic particles
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference47 articles.
1. Improved thermal conductivity in microelectronic encapsulants
2. Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging
3. Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging
4. Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation
5. Thermally conductive silicone rubber reinforced with boron nitride particle
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