Properties and origins of high-performance poly(phenylene oxide)/cyanate ester resins for high-frequency copper-clad laminates
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/app.33745/fullpdf
Reference40 articles.
1. Correlation of residual stress and adhesion on copper by the effect of chemical structure of polyimides for copper-clad laminates
2. Lu , J. C. Hwang , Y. T. A novel resin composition for low DK copper clad laminate 2009
3. Characterization and dielectric property of polyimide-silica composite films prepared via sol–gel and thermal imidization process
4. Low dielectric epoxy resins from dicyclopentadiene-containing poly(phenylene oxide) novolac cured with dicyclopentadiene containing epoxy
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