Three‐stage GaN‐on‐SiC medium‐power LNA exploiting a current‐reuse architecture-Reference-Cited by-同舟云学术

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Three‐stage GaN‐on‐SiC medium‐power LNA exploiting a current‐reuse architecture

Published:2018-05-16 Issue:9 Volume:28 Page:
ISSN:1096-4290
Container-title:International Journal of RF and Microwave Computer-Aided Engineering
language:en
Short-container-title:Int J RF Microw Comput Aided Eng

Author:

Colangeli Sergio¹^ORCID,Vittori Marco¹,Ciccognani Walter¹,Limiti Ernesto¹

Affiliation:

1. Department of Electronics Engineering, Via del Politecnico 1University of Roma Tor VergataRoma00133 Italy

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/mmce.21423

Reference21 articles.

1. LimitiE CiccognaniW CiprianiE et al. T/R modules front‐end integration in GaN technology. In IEEE Annual Wireless and Microwave Technology Conference (WAMICON);2015 pp.1–6.

2. On the operation of cascode gain stages

3. A Low-Noise Amplifier

4. Analysis and Design of Stacked-FET Millimeter-Wave Power Amplifiers

5. Fully Integrated Class-J Power Amplifier in Standard CMOS Technology

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Simple Synthesis Methodology for 3-Stage LNA Design in GaAs Technology;2024 19th Conference on Ph.D Research in Microelectronics and Electronics (PRIME);2024-06-09

2. Stacked-Cascode Current Steering Architecture for Gallium Nitride Variable-Gain LNAs;2023 IEEE 14th Latin America Symposium on Circuits and Systems (LASCAS);2023-02-27

3. An X-Band State Adjustable Low Noise Amplifier Using Current Reuse Technique;Electronics;2023-01-31

4. Design ofGaN‐basedX‐band LNAsto achieve sub‐1.2 dBnoise figure;International Journal of RF and Microwave Computer-Aided Engineering;2022-09-06

5. A scalable electrothermal model using a three‐dimensional thermal analysis model for GaN‐on‐diamond high‐electron‐mobility transistors;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2021-02-25

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