Transverse impacts‐induced deformation and damage of 3D angle‐interlock woven composites at elevated temperatures

Author:

Ren Chunlei1,Wei Jingnan1,Jia Menglong1

Affiliation:

1. College of Textiles College of Intelligent Textile and Fabric Electronics Zhongyuan University of Technology Zhengzhou China

Abstract

AbstractThis paper investigated the effect of elevated temperature on the impact‐induced deformation and damage behavior of 3D angle‐interlock woven composites. The transverse impacts were carried out at high temperatures of 90°C and 130°C using Split Hopkinson Pressure Bar matched with controlled environmental device. A meso‐scale finite element model considering the thermal‐mechanical coupling has been developed, and the numerical results were compared with the experimental data and high‐speed photography to study the effect of temperature and reinforcement architecture on the dynamic behaviors of the composites. The damage mechanisms at elevated temperatures were studied. Results show that the impact resistance of the 3D angle‐interlock woven composites degraded at the glassy region of the epoxy resin, then enhanced at the glass transition temperature (Tg), this phenomenon became more pronounced in the warp direction. Such behavior should be ascribed to the improved toughness and ductility of the resin matrix. The local plastic deformation of resin before damage slowed down matrix cracking and composites failure. Further, the reinforcement play a key role in the adiabatic heating and plastic deformation of the composites at high temperature.Highlights The impact test of 3D woven composites was conducted at elevated temperatures. The high temperature significantly affects the dynamic properties of composites. The increased toughness and plasticization of resin diminished impact damage. A mesoscale thermo‐mechanical coupled finite element model was developed. The reinforcement plays a key role in the damage process and adiabatic heating.

Publisher

Wiley

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3