Degradation of poly(ethylene glycol) by electrolysis during the Cu electroplating: A combined experimental and density functional theory study
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference29 articles.
1. Inhibition Due to the Interaction of Polyethylene Glycol, Chloride, and Copper in Plating Baths: A Surface-Enhanced Raman Study
2. Effects of Additives on Copper Electrodeposition in Submicrometer Trenches
3. Electrodeposition of Cu in the PEI-PEG-Cl-SPS Additive System
4. Effect of Additives on Shape Evolution during Electrodeposition
5. Effect of Additives on Shape Evolution during Electrodeposition
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